WeEn SiC MOSFET Bare Die Product

Based on WeEn's outstanding SiC MOSFET technology and extensive product platform, to meet the demand for SiC Bare Die products in power modules for industrial, automotive, and other fields, WeEn offers SiC MOSFET Bare Die products as well. WeEn SiC MOSFETs continuously increasing the chip power density through optimized wafer design. The products cover the requirements of various applications of high-voltage power devices, including servers, UPS, photovoltaics (PV), energy storage, xEV and EV charging, and so on. Furthermore, all wafers have passed product stability validation and proven market performance in WeEn's discrete devices and power modules. WeEn SiC MOSFETs offer voltage platforms of 650V, 750V, 1200V, 1400V, 1700V, and 2200V, with on-resistance ranging from 9mΩ to 1000mΩ. Customization is available per customer requirements, empowering module products with enhanced competitiveness.

WeEn SiC Bare Die Product Options:

Backside/Frontside Metallization Types:

• Aluminum-Copper ( Al (Cu) ), 

• Nickel-Palladium-Gold (Ni Pd Au) 

• Titanium-Nickel-Silver (Ti Ni Ag)

Sawing & Packaging Formats：

• Un-Sawn wafer

• Sawn wafer on film with frame

• Sawn wafer in tray

WeEn SiC Bare Die Product Naming Rule:

WeEn SiC Diode Bare Die Product list:

For specifications or parameters of wafer products not listed in the table above, please refer to the corresponding WeEn discrete device datasheets at first.

To obtain wafer product datasheets, samples, or other technical support, please contact the WeEn sales team or authorized distribution partners.