Quality systems have been implemented in WeEn Semiconductors, which conform to the requirements of IATF 16949 and ISO 9001. Our sites are certified to ISO 9001 and (where products are manufactured) IATF 16949.As part of the Quality system, formal procedures have been established which ensure that Quality is built into the design and development of all products, processes and packages.
Effective systems of performance measurement, benchmarking, deployment and communication have been established which enable continuous improvement. We strive to continuously improve our products and processes using a variety of tools and approaches.
Certifications
WeEn Semiconductor is committed to the standardization of its corporate management system and has obtained certifications such as IATF16949,QC080000,ESD S20.20.
ISO 9001
The standard for a Quality Management System set by International Organization for Standardization(ISO), which is based on a number of quality management principles, to ensure that customers get consistent, good-quality products and services, in turn brings many business benefits.
ISO 14001
The standard for an environmental management system set by ISO, which can provide assurance to company management and employees as well as external stakeholders that environmental impact is being measured and improved.
ISO 45001
The standard for a management system of occupational health and safety set by ISO, the organizations are serious about improving employee safety, reducing workplace risks and creating better, safer working conditions.
IATF 16949
This Automotive QMS Standard is created by the International Automotive Task Force (IATF) with a common set of techniques and methods for common product and process development for automotive manufacturing worldwide, aligns with ISO 9001.
CNAS
WeEn's labortary of reliability test and failure analysis is certificated by China National Accreditation Service for Conformity Assessment (CNAS), comply with the standards of CNAS-CL01 and ISO 17025.
QC 080000
The standard of QC 080000 is designed to evaluate the organizations' processes for compliance with IECQ Hazardous Substance Process Management (HSPM), comply with relevant national or regional laws and regulations.
Experiment Center
WeEn Semiconductor Experiment Center has a domestic first-class laboratory of semi-conductor device reliabity evaluation and failure analysis, and the laboratory projects refer to the relevant AECQ、IEC/JEDEC standards. There are two main businesses: reliability evaluation experiment and failure analysis experiment.
The center was certified by CNAS. It is the first semiconductor company in Jiangxi Province with a CNAS accreditation certificate from the China National Accreditation Service for Conformity Assessment.
WeEn Semiconductors Technology Co., Ltd. Experiment Center
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Nanchang, Jiangxi, China
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+86 0791-85952909
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Reliability evaluation experiment
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Failure analysis experiment
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Reliability is the most basic and important quality characteristic of a product. The laboratory is established in accordance with industry international standards and has complete experimental capabilities. It can conduct reliability growth tests, reliability qualification tests, endurance life tests, etc. of electronic products, and can conduct customized reliability experiments according to customer needs
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Test item: High Temperature Reverse Biased Test (HTRB)
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Product covered：
MOSFET、IGBT、DIODE、Transistor、SCR and discrete semi-conductor devices
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Test capability：
max. temp. up to 200℃; max. voltage up to 2000V
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Executive Standard ：
JEDEC, AEC or special request from customer
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Test item: High Temperature, High Humidity Reverse Biased (H3TRB)
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Product covered：
MOSFET、IGBT、DIODE、Transistor、SCR and discrete semi-conductor devices
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Test capability：
Temp. ranged from -20 ℃ ~150℃, 25%~98%RH max. voltage up to 2000V
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Executive Standard ：
JEDEC, AEC or special request from customer
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Test item: High Temperature Operating Life (HTOL)
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Product covered：
MOSFET、IGBT、DIODE、Transistor、SCR and discrete semi-conductor devices
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Test capability：
Max. temp. up to 200℃; max. current up to 60A
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Executive Standard ：
JEDEC, AEC or special request from customer
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Pressure Cooker Test (PCT)
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Product covered：
MOSFET、IGBT、DIODE、Transistor、SCR and discrete semi-conductor devices
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Test capability：
Temp. 121℃, Humidity 100%, pressure: 1 atm
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Executive Standard ：
JEDEC, AEC or special request from customer
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Test item: High Temperature Storage Life (HTSL)
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Product covered：
MOSFET、IGBT、DIODE、Transistor、SCR and discrete semi-conductor devices
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Test capability：
Max. temp. up to 300℃
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Executive Standard ：
GB; JEDEC, AEC or special request from customer
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Test item: Intermittent Operating Life (IOL)
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Product covered：
MOSFET、IGBT、DIODE、Transistor、SCR and discrete semi-conductor devices
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Test capability：
ΔTj≧100℃, Max. voltage up to 80V, Max. current up to 60A
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Executive Standard ：
MIL; AEC or special request from customer
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Test item: Pre-conditioning (Pre-con)
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Product covered：
All surface mount package semi-conductor devices
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Test capability：
Equipment can fulfil all MSLs evaluation requirement
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Executive Standard ：
JEDEC, AEC or special request from customer
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Test item: Highly Accelerated Stress Test (HAST)
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Product covered：
MOSFET、IGBT、DIODE、Transistor、SCR and discrete semi-conductor devices
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Test capability：
Temp. 130℃/110℃, Relative humidity 85%, Max. voltage up to 2000V
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Executive Standard ：
JEDEC, AEC or special request from customer
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Test item: Moisture Sensitive Level (MSL)
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Product covered：
All surface mount package semi-conductor devices
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Test capability：
Equipment can fulfil all MSLs evaluation requirement
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Executive Standard ：
JEDEC or special request from customer
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Test item: Low Temperature Storage Life (LTSL)
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Product covered：
MOSFET、IGBT、DIODE、Transistor、SCR and discrete Semi-conductor devices
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Test capability：
Temp. Min. up to -75 ℃
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Executive Standard ：
JEDEC, AEC or special request from customer
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Test item: Solderability Test
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Product covered：
MOSFET、IGBT、DIODE、Transistor、SCR and discrete semi-conductor devices
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Test capability：
Both lead- or lead-free devices
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Executive Standard ：
JEDEC, AEC or special request from customer
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Test item: Temperature Cycling Test (TCT)
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Product covered：
MOSFET、IGBT、DIODE、Transistor、SCR and discrete semi-conductor devices
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Test capability：
Temp. ranged: -75℃~250℃
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Executive Standard ：
MIL; AEC or special request from customer
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Test item: High Temperature Gate Bias (HTGB)
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Product covered：
MOSFET、IGBT等分立器件
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Test capability：
Max. temp up to 150℃; Max. voltage up to 2000V
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Executive Standard ：
JEDEC, AEC or special request from customer
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Test item: Unbiased Highly Accelerated Stress Test (UHAST)
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Product covered：
MOSFET、IGBT、DIODE、Transistor、SCR and discrete semi-conductor devices
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Test capability：
Temp. 130℃/110℃, Humidity 85%, Pressure: 250kPa
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Executive Standard ：
JEDEC, AEC or special request from customer
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Test item: Power Testfor Module
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Product covered：
IGBT/Diodes/SCR module
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Test capability：
Current 500A / Voltage 20V
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Executive Standard ：
MIL or special request from customer
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Test item: High Temperature Reverse Bias Test for module (HTRB)
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Product covered：
IGBT/Diodes/SCR module
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Test capability：
Max. voltage up to 3000V
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Executive Standard ：
MIL or special request from customer
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For failed or defective components, use electrical parameter test analysis techniques and follow the analysis procedures to confirm their failure phenomena; distinguish failure modes or mechanisms; determine their ultimate failure causes; propose improvements and preventive measures and improve product design and process technology. Reduce invalidation and arbitration invalidation accidents play an extremely important role
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Test item: Ultrasonic testing (SAT)
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Product covered：
IC and discrete semi-conductor devices
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Test capability：
Percentage of delamination area calculation; Defect size identification; thickness and distance measurement and other functions
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Executive Standard ：
IPC/JEDEC
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Test item: Devices decapsulation
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Product covered：
IC, Discrete semi-conductor devices and Module
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Test capability：
Laser unpacking, chemical unpacking, sample peeling
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Executive Standard ：
According to customer requirement
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Test item: Size measurement
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Product covered：
MOSFET、IGBT、DIODE、Transistor、SCR，IC and discrete semi-conductor devices
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Test capability：
Stereoscopic imaging: maximum 20-200X; metallographic imaging: maximum 1000 times; digital imaging: maximum 6000 times
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Executive Standard ：
JEDEC, AEC or special request from customer
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Test item: X-ray inspection
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Product covered：
IC and discrete semi-conductor devices
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Test capability：
The highest resolution is 2um. It has functions such as calculating the percentage of void area, marking the size of defects, and measuring thickness and distance. Two-dimensional scan and three-dimensional CT scan can be performed
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Executive Standard ：
According to customer requirement
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Test item: Decapsulation
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Product covered：
IC and discrete semi-conductor devices
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Test capability：
Chemical decapsulation
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Executive Standard ：
According to customer requirement
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Test item: Take photo
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Product covered：
MOSFET、IGBT、DIODE、Transistor、SCR and discrete semi-conductor devices
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Test capability：
3D puzzle, high and low magnification optical microscope
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Executive Standard ：
According to customer requirement
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Test item: FIB (Focused ion beam)
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Product covered：
IC and discrete semi-conductor devices
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Test capability：
he application of FIB (Focused Ion Beam) machine is to irradiate an ion source mixed with gallium, liquid and metal on the surface of the sample to obtain images or remove substances: Cross-Section Analysis: Use FIB to make cross-section faults at specific positions of the IC chip to observe the cross-section structure and material of the material,
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Executive Standard ：
According to customer requirement
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Test item: Probe Test
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Product covered：
Discrete semi-conductor devices
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Test capability：
Liquid crystal method-leakage analysis, the use of liquid crystal sensing to detect IC leakage and molecular arrangement and reorganization, showing a patchy image different from other areas under the microscope, to find the leakage area that troubles the designer in the actual analysis (the fault point exceeding 10mA)
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Executive Standard ：
According to customer requirement
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Test item: I-V Curve Tracer test
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Product covered：
Discrete semi-conductor devices
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Test capability：
Curve Tracer provides characteristic measurement of semiconductor electronic components, electrical failure analysis measurement (EFA, Electrical Failure Analysis) and curve drawing (IV-CURVE)
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Executive Standard ：
According to customer requirement
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Test item: SEM/EDX (Scanning electron microscope/energy spectrometer)
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Product covered：
Discrete semi-conductor devices
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Test capability：
The manufacture of scanning electron microscopes is based on the interaction between electrons and matter. When a beam of high-energy incident electrons bombard the material surface, the excited area will generate secondary electrons, X-ray signals, backscattered electrons, transmitted electrons, and electromagnetic radiation generated in the visib
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Executive Standard ：
According to customer requirement
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RHF Identification Codes
N:Non-RoHS compliant = Indicates all non-RoHS compliant products, whether or not they contain halogens or antimony.
E:Exempted = Indicates products containing exempted lead and containing halogens/antimony.
H:Halogen/Antimony-Free = Indicates products containing exempted lead, but free of halogen and antimony.
G:Green = Indicates products that fully comply to the EU Directive 2011/65/EU (RoHS)
D:Dark Green = Products as G, but in addition free of Halogens/Antimony
* RHF code can be found in the website for every product type.
* Please get the chemical content in the website, or ask your local WeEn representative.
