WeEn SiC Diode Bare Die Product

Based on WeEn's outstanding SiC Diode technology and extensive product platforms, to meet the demand for SiC Bare Die products in power modules for industrial, automotive, and other fields, WeEn is providing SiC Diode Bare Die products as well. Currently, WeEn's SiC Diode provides voltage platforms of 650V, 750V, 1200V, 1400V, 1700V, and 2200V. Utilizing advanced MPS (Merged PiN Schottky diodes) technology, these diodes achieve a very low forward voltage drop (VF) down to 1.45V. Notably, leveraging WeEn's outstanding 6th generation MPS process, the 650V and 750V products achieve VF as low as 1.26 V. These products cover various applications, including servers, UPS, photovoltaics (PV), energy storage, xEVs and EV charging, and so on.

WeEn SiC Bare Die Product Feature Options:

Bottom side / Top side Metallization Types:

• Aluminum-Copper ( Al (Cu) ), 

• Nickel-Palladium-Gold (Ni Pd Au) 

• Titanium-Nickel-Silver (Ti Ni Ag)

Sawing & Packaging Formats：

• Un-Sawn wafer, 

• Sawn wafer on film with frame 

• Sawn wafer in tray

WeEn SiC Bare Die Product Naming Rules:

WeEn SiC Diode Bare Die Product list:

For specifications or parameters of wafer products not listed in the table above, please refer to the corresponding WeEn discrete device datasheets at first.

To obtain wafer product datasheets, samples, or other technical support, please contact the WeEn sales team or authorized distribution partners.