The ESDHDxxBC series are designed to protect voltage sensitive components which are connected to data and transmission lines from overvoltage caused by ESD (electrostatic discharge), CDE (Cable Discharge Events), and EFT (electrical fast transients). Excellent clamping capability , this series offers a low leakage current in a miniature SOD323 package.

Features and Benefits
  • Peak pulse power 350W @ 8/20μs waveform
  • IEC 61000-4-2 (ESD) ±30kV(air), ±30kV(contact)
  • Protects Bi-directional I/O line
  • Low clamping voltage
  • Low leakage current
  • Meet MSL level1
  • Halogen free and RoHS compliant
  • Computer Interfaces Protection
  • Microprocessors Protection
  • Serial and Parallel Ports Protection
  • Control Signal Lines Protection
  • Power lines on PCB Protection
  • Portable instrumentation
  • Peripherals
Quality, reliability & chemical content
Type Number Symbol Parameter Conditions Min Typ/Nom Max Unit
ESDHD03BC VRWM  reverse working voltage       3.3 V
VBR  reverse breakdown voltage  IT = 1 mA 3.6     V
Tj  junction temperature   -55   150 °C
VC  clamping voltage  IPP = 1 A; tp = 8/20 μs     7.5 V
 IPP = 25 A; tp = 8/20 μs     16 V
IPP  peak pulse current  8/20μs waveform     25 A
IR  reverse leakage current  VR = 3.3 V     1 μA
Cj  Junction Capacitance  VR = 0 V; f = 1 MHz;   150   pF
Type number Package Packing Product status Marking Orderable part number Ordering code (12NC)


STANDARD MARK SMDVolume productionStandard MarkingESDHD03BCX9340 730 87115
Type number Ordering code (12NC) Orderable part number Region Distributor Order sample

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Chemical content Orderable part number Type number RoHS / RHF Leadfree conversion date MSL MSL LF
ESDHD03BCESDHD03BCXESDHD03BCLeaded  Dalways Pb-free11


All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, WeEn Semiconductors does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. WeEn Semiconductors may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.