WNSC6D06650T

Silicon Carbide Schottky diode in a DFN 8*8 plastic package, designed for high frequency switched-mode power supplies.

Features and Benefits
• New 6th Generation Technology
• Low Forward Voltage Drop
• Low Reverse Leakage Current
• High Forward Surge Capability IFSM
• Reduced Losses in Associated MOSFET
• Reduced EMI
• Reduced Cooling Requirements
• RoHS Compliant
Applications
• Power factor correction
• Telecom / Server SMPS
• UPS
• PV inverter
• PC Silverbox
• LED / OLED TV
• Motor Drives

 

Parametric
Package
Quality, reliability & chemical content
Ordering
Type Number Symbol Parameter Conditions Min Typ/Nom Max Unit
WNSC6D06650T VRRM  repetitive peak reverse voltage       650 V
IF(AV)  average forward current  δ = 0.5; square-wave pulse; Tc ≤ 157 °C     6 A
Tj  junction temperature   -55   175 °C
VF  forward voltage  IF = 6 A; Tj = 25 °C   1.26 1.4 V
Qr  reverse charge  IF = 6 A; VR = 400 V; dIF/dt = 500 A/µs; Tj = 25 °C   13.5   nC
Type number Package Packing Product status Marking Orderable part number Ordering code (12NC)
WNSC6D06650T

DFN8X8

STANDARD MARK SMD Volume production Standard Marking WNSC6D06650T6J 9340 729 21118
Datasheet
Type number Ordering code (12NC) Orderable part number Region Distributor Order sample
WNSC6D06650T 9340 729 21118 WNSC6D06650T6J NA NA  

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Chemical content Orderable part number Type number RoHS / RHF Leadfree conversion date MSL MSL LF
WNSC6D06650T WNSC6D06650T6J WNSC6D06650T Leaded  D always Pb-free   3

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, WeEn Semiconductors does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. WeEn Semiconductors may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.