Silicon Carbide Schottky diode in a TO220-2L plastic package, designed for high frequency switched-mode power supplies.

Features and Benefits
• New 6th Generation Technology
• Low Forward Voltage Drop
• Low Reverse Leakage Current
• High Forward Surge Capability IFSM
• Reduced Losses in Associated MOSFET
• Reduced EMI
• Reduced Cooling Requirements
• RoHS Compliant
• Power factor correction
• Telecom / Server SMPS
• PV inverter
• PC Silverbox
• Motor Drives


Quality, reliability & chemical content
Type Number Symbol Parameter Conditions Min Typ/Nom Max Unit
WNSC6D04650 VRRM  repetitive peak reverse voltage       650 V
IF(AV)  average forward current  δ = 0.5 ; Tmb ≤ 159 °C; square-wave pulse     4 A
Tj  junction temperature       175 °C
VF  forward voltage  IF = 4 A; Tj = 25 °C   1.26 1.4 V
 IF = 4 A; Tj = 150 °C   1.35 1.55 V
Qr  recovered charge  IF = 4 A; dIF/dt = 500 A/µs; VR = 400 V; Tj = 25 °C   9   nC
Type number Package Packing Product status Marking Orderable part number Ordering code (12NC)


HORIZONTAL, RAIL PACK Volume production Standard Marking WNSC6D046506Q 9340 729 13127
Type number Ordering code (12NC) Orderable part number Region Distributor Order sample
WNSC6D04650 9340 729 13127 WNSC6D046506Q NA NA  


Chemical content Orderable part number Type number RoHS / RHF Leadfree conversion date MSL MSL LF
WNSC6D04650 WNSC6D046506Q WNSC6D04650 Leaded  D always Pb-free    


All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, WeEn Semiconductors does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. WeEn Semiconductors may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.