Silicon Carbide Schottky diode in a TO263 (D2PAK) plastic package, designed for high frequency switched-mode power supplies

Features and Benefits
• Highly stable switching performance
• Extremely fast reverse recovery time
• Superior in efficiency to Silicon Diode alternatives
• Reduced losses in associated MOSFET
• Reduced EMI
• Reduced cooling requirements
• RoHS compliant
• Power factor correction
• Telecom / Server SMPS
• PV inverter
• PC Silverbox
• Motor Drives


Quality, reliability & chemical content
Type Number Symbol Parameter Conditions Min Typ/Nom Max Unit
WNSC5D10650B VRRM  repetitive peak reverse voltage       650 V
IF  average forward current  Tmb ≤ 138 °C, DC     10 A
Tj  junction temperature    -55   175 °C
VF  forward voltage  IF = 10 A; Tj = 25 °C   1.45 1.70 V
 IF = 10 A; Tj = 150 °C   1.80 2.20 V
Qr  recovered charge  IF = 10 A; dIF/dt = 500 A/µs; VR = 400 V; Tj = 25 °C   14.5   nC
Type number Package Packing Product status Marking Orderable part number Ordering code (12NC)


STANDARD MARK SMD Volume production Standard Marking WNSC5D10650B6J 9340 729 67118
Type number Ordering code (12NC) Orderable part number Region Distributor Order sample
WNSC5D10650B 9340 729 67118 WNSC5D10650B6J NA NA  


Chemical content Orderable part number Type number RoHS / RHF Leadfree conversion date MSL MSL LF
WNSC5D10650B WNSC5D10650B6J WNSC5D10650B Leaded  D Always Pb-free   3


All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, WeEn Semiconductors does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. WeEn Semiconductors may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.