WeEnPACK-B1 module with WeEn 1200V Gen2 SiC MOSFET and Integrated NTC temperature sensor, configured with Pressfit pin and pre-applied thermal paste.
- Half bridge topology
- PressFit pins technology
- Pre-applied thermal interface material
- Low RDSon
- Low Switching Losses
- Low Qg and Crss
- Low Inductive Design
- Integrated with NTC temperaure sensor
- Auxiliary Inverters
- DC-DC converters
- Automotive Applications
- Hybrid Electrical Vehicles (H)EV
| Type Number | Symbol | Parameter | Conditions | Min | Typ | Max | Unit |
| WMSC010H12B1L | VDS | drain-source voltage | 1200 | V | |||
| ID | drain current | VGS = 18 V; Th = 25 °C | 145 | A | |||
| Tj | junction temperature | -40 | 150 | °C | |||
| RDS(on) | drain-source on-state resistance |
VGS = 15 V; ID = 100 A; Tj = 25 °C | 10 | mΩ | |||
| VGS = 18 V; ID = 100 A; Tj = 25 °C | 8.3 | 14 | mΩ | ||||
| QG(tot) | total gate charge | ID = 100 A; VDS = 800 V; VGS = -4 V/18 V; Tj = 25 °C |
402 | nC | |||
| QGD | gate-drain charge | 62 | nC | ||||
| Qr | recovered charge | ISD = 100 A; VGS = -4 V; di/dt = 6500 A/μs; VR = 600 V; Tj = 25 °C |
950 | nC |
| Type number | Package | Packing | Product status | Marking | Orderable part number | Ordering code (12NC) |
|---|---|---|---|---|---|---|
| WMSC010H12B1L |
WeEnPACK-B1 | STANDARD MARKING*TRAY PACK,EPE OR BLISTER | Volume production | Standard Marking | WMSC010H12B1L6T | 9340 744 44300 |
| Type number | Ordering code (12NC) | Orderable part number | Region | Distributor | Order sample |
|---|---|---|---|---|---|
| WMSC010H12B1L | 9340 744 44300 | WMSC010H12B1L6T | NA | NA |
| Chemical content | Orderable part number | Type number | RoHS / RHF | Leadfree conversion date | MSL | MSL LF |
|---|---|---|---|---|---|---|
| WMSC010H12B1L | WMSC010H12B1L6T | WMSC010H12B1L | 
 |
Chemical Content - WMSC010H12B1L
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, WeEn Semiconductors does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. WeEn Semiconductors may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
