The ESDHDxxBF series are designed to protect voltage sensitive components which are connected to data and transmission lines from overvoltage caused by ESD (electrostatic discharge), CDE (Cable Discharge Events), and EFT (electrical fast transients). Excellent clamping capability, low leakage, and fast response time, make these parts ideal for ESD protection on designs where board space is at a premium.

Features and Benefits
  • ESD and surge protection for interface lines
  • IEC 61000-4-2 (ESD) ±30kV (air), ±30kV (contact)
  • Protects Bi-directional I/O line
  • Low clamping voltage
  • Low leakage current
  • Meet MSL level1
  • Halogen free and RoHS compliant
  • Computer Interfaces Protection
  • Microprocessors Protection
  • Serial and Parallel Ports Protection
  • Control Signal Lines Protection
  • Power lines on PCB Protection
  • Portable instrumentation
  • Peripherals
Quality, reliability & chemical content
Type Number Symbol Parameter Conditions Min Typ/Nom Max Unit
   ESDHD15BF VR  reverse working voltage       15 V
VBR  reverse breakdown voltage  IT = 1 mA 16.5     V
Tj  junction temperature   -55   150 °C
VC  clamping voltage  IPP = 1 A; tp = 8/20 μs     24 V
 IPP = 7 A; tp = 8/20 μs     35 V
IPP  peak pulse current  8/20μs waveform     7 A
IR  reverse leakage current  VR = 15 V     1 μA
Cj  Junction Capacitance  VR = 0 V; f = 1 MHz;   15   pF
Type number Package Packing Product status Marking Orderable part number Ordering code (12NC)


STANDARD MARK SMD Volume production Standard Marking ESDHD15BFX 9340 729 84115
Type number Ordering code (12NC) Orderable part number Region Distributor Order sample
ESDHD15BF 9340 729 84115 ESDHD15BFX NA NA  


Chemical content Orderable part number Type number RoHS / RHF Leadfree conversion date MSL MSL LF


All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, WeEn Semiconductors does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. WeEn Semiconductors may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.