Key Areas of Accountability:

• Link wafer FAB and Assembly factory, cooperate with package team to finish new product assembly, manage assembly engineering sample build schedule and analysis final test data.
• Maintain the product release process, such as BOM, test spec and yield analysis.
• Electrical characterization of power devices, such as I-V, C-V and double pulse test.

Requirements:

• Education Background: Bachelor’s degree in electrical engineering, Microelectronics, Semiconductor device physics or related area, Master is preferred.
• Minimum 3 years working experience in Semiconductor final test area or new product development.
• Solid knowledge of semiconductor package is preferred.