WG30N65HJ1

WG30N65HJ1 uses advanced Fine Trench Field-stop technology IGBT in TO3PF package to provide extremely low Vce(sat), and excellent switching performance. This device offers Best-in-Class efficiency in hard switching and resonant topology.

Features and Benefits
  • Maximum junction temperature 175 °C
  • Positive Temperature efficient for easy paralleling
  • High switching speed
  • EMI Improved Design
Applications
  • PFC
  • Solar converters
  • UPS
  • Welding Converters
  • Mid to high range switching frequency converters
Parametric
Package
Quality, reliability & chemical content
Ordering

 

Type Number Symbol Parameter Conditions Min Typ Max Unit
WG30N65HJ1 VCE  collector-emitter voltage  Tj ≥ 25 °C     650 V
IC  collector current  limited by Tj(max); TC = 100 °C     17 A
VCE(sat)  collector-emitter saturation voltage  VGE = 15 V; IC = 30 A; Tj = 25 °C   1.55 2.10 V
Type number Package Packing Product status Marking Orderable part number Ordering code (12NC)
WG30N65HJ1

SOT1293

STANDARD MARKING * HORIZONTAL, RAIL PACKVolume productionStandard MarkingWG30N65HJ1Q9340 740 62127
Datasheet
Type number Ordering code (12NC) Orderable part number Region Distributor Order sample
WG30N65HJ19340 740 62127WG30N65HJ1QNANA

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Chemical content Orderable part number Type number RoHS / RHF Leadfree conversion date MSL MSL LF
WG30N65HJ1WG30N65HJ1QWG30N65HJ1Leaded  H

Chemical Content - WG30N65HJ1

 

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, WeEn Semiconductors does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. WeEn Semiconductors may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.